Optical EchoProbe 413光学反射探针
Latest Optical Technique
最新的光学技术
Ideal solution for Wafer Backgrind and Etch Thickness Gauging on Si, GaAs or III-Vs, non-conducting materials like Glass, Tape
硅片背面研磨蚀刻厚度测量最理想方案用于Si, GaAs或者III-Vs,非导电材料比如玻璃，胶带
Optical EchoProbe Technology光学反射探针技术
Low Coherence Interferometry (other than classical interferometry) is suitable for rough surfaces even in the case of speckle imaging. This makes it interesting for industrial use.
低相干干扰量度法（不同于传统的干扰量度法）适用于粗糙表面，甚至是斑点图象。这另它适用于工业使用。
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Fiber-optic implementation of Michelson interferometer LS with low coherence light source
低凝聚光源的迈克尔逊干涉仪光纤启用
Light source:光源
Superluminescent broad band Diode Center Wavelength 1315 nm
Bandwidth >50 nm超发光宽频二极管中心波长1315nm频宽>50nm
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Optical EchoProbe Technology: Measured Signal
光学反射探针技术：测量信号
When optical lengths of reference beam path and sample beam path are
equal then Interference signal is observed
当参考光束路径和式样光束路径光程长等同时，观测干扰信号
Bare Si Wafer裸硅片
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Wafer with Tape胶带硅片
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Silicon Wafer with Metal Layer and Tape金属层和胶带硅片
Solution: Dual Probe Head for non-transparent samples
方法：不透明样例，双探针头
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Vibration in-sensitive Setup振动感应装置
thermal drift eliminated消除热飘移
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●Synchronized Low Coherence Michelson Dual Interferometer干扰迈克尔逊双干扰仪
●Arrangement of two Probe Heads with synchronized low coherence dual interferometer in configuration
调整已经同步的干扰迈克尔逊双干扰仪两个探针头
●optimized for reduction of vibration noise
最大的减少振动噪声
W-Wafer, M-Mirror, MI-Michelson Interferometer, TMS moving stage/scanning mirror
Comparison of Single and Dual Probe Interferometry
单/双探针干扰量度法比较
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● Single probe system samplerequirements单探针系统样本要求
– Smooth surfaces, homogenousmaterials光滑表面，材料均匀
– Transparent substrate material透明基板材料
– Known refractive indices已知的折射指数
●Dual probe system providessolution for双探针系统适用
– Nontransparent samples
– Samples with unknown refractive indices
–非透明样本
–未知折射指数
Applications应用
●Wafer Thickness and TTV硅片厚度和TTV
●Topography构状
●Strained wafers已变形的硅片
●Profile depth轮廓深度
●Measurement of Tape胶带测量
●Warp翘曲
●Bump Height凸起高度
●Ultra Fast Measurements超快速测量