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最终清洗机-华林科纳CSE华林科纳CSE湿法处理设备是国内最早致力于集成电路湿法设备的研制单位，多年来与众多的集成电路生产企业密切合作，研制开发出适合于4吋-8吋的全自动系列湿法处理设备设备用途: 清洗槽用于6/8吋兼容，集成电路制造工艺的最終清洗。配合LOAD and UNLOAD的上下料，实现干進干出，每批次50枚Cassette Type的高效清洗。共有三种工艺槽，三水槽+一个干燥单元：1个DHF清洗槽、1个OF槽、1个SC-1槽、1个QDR槽、1个SC-2槽、1个QDR槽、1个干燥槽。设备功能:●Chemical BATH: 自動換酸，自動洗槽，自動槽內配比。●DIW BATH : Pre Flow and After Change Function。●S/D : 6/8 Inch 自動換位，旋干。●机械手臂:Chuck Open/Close Type，Speed 為可控變動；●Scheduler: 排程計算，实现多批次同時清洗，不發生Process Over Time。●Safety: Door，TEMP，LEVEL，Exhaust…等等INTERLOCK Safety。设备工艺流程:●进货区(LOAD)→DHF(100:1)→OF 槽→SC-1 槽→QDR 槽→SC-2 槽→QDR 槽→S/D 槽→→出货区(UNLOAD)●High WPH Type: AWB200-T。双Cassette 50 枚/槽。●6/8 inch 兼容Cassette Type。●前面式机械手臂: ARM-1、ARM-2、ARM-3 共三套。●机台上部设有高效过滤器（FFU)。 工艺技术指标:1. 该设备应实现全自动作业，可自动过程控制工艺、冲水及干燥全套作业，并具备自动供液、自動洗槽、SC1-1槽带有兆声；可编程选择工艺槽及工艺时间进行清洗。2. 通过DHF/SC...
管道清洗机设备—华林科纳CSE半自动石英管清洗设备适用于卧式或立式石英管清洗优点石英管清洗：卧式—标准/立式—选项 先进的图形化界面 极高的生产效率 最佳的占地 结合最先进工艺技术 优越的可靠性 独特的模块化结构 极其便于维修 应用 清洗不同尺寸的石英管一般特征 可编程使得清洗管旋转，清洗更干净 PVDF工艺槽 装有清洗溶剂的储备槽（根据使用化学品的数量）放置在工艺槽的后下方 — 直接注入且内部进行不断循环 特别的喷淋嘴更益于石英管清洗 集成水枪和N2抢 单独排液系统 安全盖子 易于操作和控制 节约用酸系统 全自动的清洗工艺步骤 备件 经济实惠的PP外壳材料—标准更多的石英管道清洗机设备相关资讯可以关注华林科纳CSE官网（www.hlkncse.com），现在热线咨询400-8768-096可立即获取免费的半导体清洗解决方案。
零部件清洗机_华林科纳CSECleanStep的零部件被设计用于PECVD刻蚀清洗设备，以及石墨舟、石英舟、碳化硅舟等扩散舟的刻蚀和清洗设备。优点 通过关闭的工艺腔室的安全操作，加载和仅一次工艺腔室冲洗之后卸载，完成整个工艺过程。 安全门自锁装置 工艺腔室保护防止水溢流 排风监控部件 用于门自锁的电导传感器（仅适用于石英舟清洗设备） 简便、安全操作的高品质触摸屏 很少的化学品消耗产生最小的生产费用，与浸泡式工艺相比至少节约2-3倍 减少了操作次数 化学品的消耗，与浸泡式工艺相比要少于大约10倍 稳定的清洗工艺，水的消耗，与浸泡式工艺相比少于2倍 设备高利用率和低维修率，得益于它独特的模块化设计和长寿命零部件的应用 最佳的占地应用CleanStep的零部件被设计用于PECVD刻蚀清洗设备，以及石墨舟、石英舟、碳化硅舟等扩散舟的刻蚀和清洗设备。标准化设计的设备是用于2个石墨舟或4个石英舟的清洗。同时也强有力的证明了用喷淋工艺代替浸泡工艺不仅节约了工艺时间，同时也节约了化学品的消耗量。选项 废液槽起重装置 系统外壳结构[FM认可材质] HF有毒气体检测装置 Centrotherm 一套石墨舟花篮可装载19片到21片晶圆«可拆卸石墨舟« Centrotherm 一套石墨舟可装载23片«可拆卸石墨舟« 石英部件清洗的石英舟夹具 漏液盘连接阀 电阻率监测装置 手动加载花篮干燥的烘干箱 30升的HNO3 / HF/ DI-H2O的预备槽 独立的设备化学品供应用于回收用过的HF 氮氧化物有毒气体检测装置 晶圆背面腐蚀的ACL片盒夹 N2 净化更多的半导体零部件清洗机设备相关资讯可以关注华林科纳CSE官网（www.hlkncse.com），现在热线咨询400-8768-096可立即获取免费的半导体清洗解决方案。
1、设备概况：主要功能：本设备主要采用手动搬运方式，通过对扩散、外延等设备的石英管、碳化硅管腐蚀、漂洗等方式进行处理，从而达到一个用户要求的清洗效果。主体采用德国劳士领 瓷白PP板，骨架采用不锈钢 外包PP 防腐板；设备名称：半自动石英管清洗机设备型号：CSE-SC-N401整机尺寸(参考)：4500mm*1500mm*2100mm；被清洗炉管尺寸（Max）：也可清洗其它可放入清洗槽中的石英器皿等被清洗物设备形式:室内放置型;节拍：约1--12小时（节拍可调根据实际工艺时间而定） 操作形式：半自动2、设备描述：此装置是一个半自动的处理设备。PROFACE 8.0英寸大型触摸屏显示 / 检测 / 操作清洗工作过程由三菱 / 欧姆龙PLC控制。3、设备特点： 腐蚀漂洗能力强,性能稳定,安全可靠;设备成本合理,自动化程度高,使用成本低;技术先进,结构合理,适宜生产线上大批次操作;结合华林科纳公司全体同仁之力,多年品质保障,使其各部分远远领先同类产品;设备上层电器控制系统及抽风系统，中层工作区，下层为管道安装维修区，主体结构由清洗机主体、酸洗槽、水清洗槽、防漏盘、抽风系统、工件滚动系统、氮气鼓泡系统、支撑及旋转驱动机构、管路部分、电控部分。本设备装有双防漏盘结构，并有防漏检测报警系统，在整台设备的底部装有接液盘。设备配有在槽体下方配有倾斜式防漏层。4、工艺流程：检查水、电、气正常→启动电源→人工上料→注酸→槽体底部氮气鼓泡→石英管转动（7转/min）→进入酸泡程序→自动排酸(到储酸箱)→槽体底部自动注水（同时气动碟阀关闭）→悬浮颗粒物经过溢流坝流出→排水碟阀打开（重颗粒杂质排出）→初级洁净水经过溢流坝溢出→清洗次数重复循环（人工控制）→下料。 酸洗和水洗在同一槽内完成1#，2#可通过循环泵循环使用...
Drying system CSE AdvantageThe CSE drying system uses IPA and N2 atomization, as well as the shape of a wafer from water.The technique of surface tension dryingDrying technology suitable for maximum size 300mm wafer can be single device or integrated in wet equipment the best area of landMature processNo water traceNo fragments Features and advantages ApplicationPolished chips, integrated circuits, MEMES, LED, photovoltaic, glass substratesGeneral characteristics can dry 25 to 50 pieces of wafer with a maximum diameter of 300mm at the same time for standard high or low side flower basketsSpecificationsProcess time: generally Hydrophilic wafer: less than 10 increase @ 0.12 MHydrophobic wafer: less than 30 increase @ 0.12 MMetal content: any metal is less than or equal t...
Wet Equipment-CSE Wet equipment Nantong CSE Semiconductor Equipment Co. Ltd. is suitable for many applications, including cleaning, etching, stripping, developing etc. Advantages of CSE wet process equipment wet equipment is suitable for many applications, including cleaning, etching, degumming and developing covers an area of small area reliability is strong unique module structureEasy maintenance and maintenance, low cost maximum compatible applicationEach module's separate air exhausting device easy to install and update modules based on the manipulator system Characteristics and advantagesMany different cleaning processes, such as RCA, IMEC, Pre-Diffusion, Pre-Metal, and various etching processes, including oxidationCompounds, nitrides, polysilicon, metals, silicide...
CSE chemical management systemThe automatic chemical management system is designed for the semiconductor industry, the micromachinery industry, and the Guang FuyeThe management of various acids, solvents and corroding agents used in it CSE chemical management systemAdvantage high securityLow cost 99.9% normal running time upgrades system covers an area of small areaA cross connection sold on a common marketTouch screen control The family members of the CSE chemical management system include chemical mixing, distribution and waste liquid recovery systems. Full automatic specialIt makes the product meet the requirements of the Fab workshop. These systems have the highest security and provide the greatest possible protectionWet equipment. The product is specially designed to be appl...
KOH etching is a chemical process used for the fabrication of silicon nanostructures. This etching process has been studied extensively in both research and real-world applications.CSE provides individualized solutions for customers that want to use this process by using theKOH etching tank along with their existing wet bench equipment. All ofCSE’s KOH tanks are manufactured on site and built per your specifications. All PFA material is used for cleanliness and compatibility.Definition of KOH EtchingPotassium Hydroxide (KOH) etching is a wet chemical etching process used to create cavities in silicon. Highly corrosive alkaline chemical compound (pH 12) is used in conjunction with DI water and thermal regulation. The etch rate is limited; and the precision of Si etching...
Manual wet cleaning equipment CSE/Ventilator CSE's manual wet equipment is a low cost, and it hasHigh level technology and highly active equipment. Our aim is to have youLimited automation should not be prevented from being brought to the end of your high end software and process controlThe economic benefits, this is the classic MANUAL WETPROCESSOR or "A ventilator. AdvantageModularized designCustomizable, extensible, and adjustable modular design to meet customer's special needsModular design, easy to insert and install module the best area of land the equipment shell itself can also be used as a ventilator the operation of a clever inverter or a passive device equipment shell can be made by customers to make use of different materials applicationThe wet proces...
WET PROCESSING-MANUAL WET BENCHESWet Processing Manual Wet Bench Stations for Clean Room ApplicationsCSE’s wet processing manual wet benches are available in a wide variety of configurations. Standard construction will support both acid and solvent applications. Our standard wet benches give you all of the process and safety features as our fully automated or semi-automatedwet bencheswithout the extra cost for robotics. Our electrical and mechanical engineers prepare sign off drawings for each wet bench order. Our 30 plus years of continues business operation gives you the satisfaction you deserve. All process, etching or cleaning components are built and designed in-house giving you complete turnkey support.Benefits of Wet Processing Manual Benches:§ High end manual eq...
Single cavity vertical dryer -CSEApplication of CSE cleaning system to various cleaning and drying processes AdvantageCSE cleaning system is applied to various cleaning and drying processesDifferent configurations (devices that can be placed on desktop operations, single independent, double chambers) for wafer size to 200mm best area, equipment with rollers can be movedSuperior reliabilityUnique modular structure it is extremely easy to repairEasy to use and operate The cleaning and drying machine is equipped with two kinds of automatic and manual systems. It is capable of complicate and different process requirements. Its stability and ease of operation will bring additional economic benefits to any factory. RinseSte can handle wafers of different sizes. The software program th...
CSE Automatic electroless electroless equipmentAdvantageThe wet process system is used for electroless aluminum plating, copper substrate material (Ni, Pd, Au)(metal UBM under convex points)Suitable for size to 300mm waferThe longest service life benefits from the most advanced software and hardware maximum reliability and compatibilityEffective support for using Fraunhofer Technology maximum capacityMore bottomed production costs CSE fully automatic electroless electroless equipment (Hua Xuedu), design and ApplicationA wafer with a maximum high capacity diameter of 300mm, unique software and hardware guaranteeLong life and unrivalled low production costs.The real-time analyzer and the optimized dosage of the process have excellent process control ability. Features and advantages...